Thermosetting resin adhesive sheet for printed circuit board manufacturing
A lineup tailored to specific uses.
This product consists of a thermosetting resin blended according to its intended use, stretched to approximately 120 micrometers, and provided sandwiched between release films. This material is intended for printed circuit board manufacturers and is not something that can be adhered at room temperature and atmospheric pressure like commercially available double-sided tape. The resin is delivered in a semi-cured (B-stage) state. Depending on the season, thermal curing may begin due to outdoor or room temperatures, so we may deliver it using a so-called "cool delivery" service after consulting with the customer.
- Company：利昌工業
- Price：Other
